Inkjet-/3D-/4D-Printed Wireless Ultrabroadband Modules for IoT, Smartag and Smart City Applications.

SMART cities; PASSIVE components; THREE-dimensional printing; ARTIFICIAL skin; PACKAGE printing; FLEXIBLE electronics

This publication provides an overview of additive manufacturing techniques including Inkjet, 3D and 4D printing methods. The strengths, opportunities and advantages of this array of manufacturing techniques are evaluated at different scales. We discuss first the applicability of additive manufacturing techniques at the device scale including the development of origami inspired tunable RF structures as well as the development of skin-like conformal, flexible systems for wireless/IoT, Smartag and smart city applications. We then discuss application at the package scale with on package printed antennas and functional packaging applications. Following this, there is a discussion of additive manufacturing techniques in applications at the die scale such as 3D printed interconnects. The paper is concluded with an outlook on future advancements at the component scale with the potential for fully printed passive components. [ABSTRACT FROM AUTHOR]

Copyright of International Journal of High Speed Electronics & Systems is the property of World Scientific Publishing Company and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)