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Is thermal management up to the high-performance computing challenge? Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
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- Author(s): Keller, John
- Source:
Military & Aerospace Electronics. Oct2021, Vol. 32 Issue 10, p26-32. 6p.
- Additional Information
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- Abstract:
The article presents the discussion on embedded computing designers squeezing the most out of conduction, convection, and liquid cooling. Topics include processing for demanding systems like electronic warfare (EW), surveillance and reconnaissance, and image processing; and cooling and thermal management challenges ranging from conduction cooling.
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