Authors : Xiao S; Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China.; College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China.
Source:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2023 Jan 04; Vol. 23 (2). Date of Electronic Publication: 2023 Jan 04.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220
Authors : Falster G; Australian Research Council Centre of Excellence for Climate Extremes, Canberra, Australian Capital Territory, Australia. .; Department of Earth and Planetary Sciences, Washington University in St. Louis, St. Louis, MO, USA. .
Source:
Nature [Nature] 2023 Oct; Vol. 622 (7981), pp. 93-100. Date of Electronic Publication: 2023 Aug 23.Publisher: Nature Publishing Group Country of Publication: England NLM ID: 0410462 Publication Model: Print-Electronic Cited Medium: Internet ISSN: