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Conference

Author Index.

  • Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p1747-1752, 6p

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Conference

Author Index.

  • Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p1257-1262, 6p

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Conference

Author Index.

  • Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p457-462, 6p

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Conference

Author Index.

  • Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p2229-2234, 6p

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Conference

Program in chronological order.

  • Source: 2015 37th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC); 2015, p1-214, 214p

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Conference

Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces.

  • Source: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p523-526, 4p

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  • 1-10 of  20 results for "Kim, Patti, 1970-"