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Author Index.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p1747-1752, 6p

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Author Index.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p1257-1262, 6p

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Author Index.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p457-462, 6p

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Author Index.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, p2229-2234, 6p

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Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces.

• Authors : Chih-Han Tseng; Liu, Chien-Min; Lin, Han-wen

• Source: 2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p523-526, 4p

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Program in chronological order.

• Source: 2015 37th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC); 2015, p1-214, 214p

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2001 IEEE 32nd Annual Power Electronics Specialists Conference.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, pi-xxxiv, 34p

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2001 IEEE 32nd Annual Power Electronics Specialists Conference.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, pi-xxxiv, 34p

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2001 IEEE 32nd Annual Power Electronics Specialists Conference.

• Source: 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230); 2001, pi-xxxiv, 34p

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ICSLP 96.

• Source: Proceeding of Fourth International Conference on Spoken Language Processing ICSLP '96; 1996, Issue 4, p4-36, 33p

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