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Therapeutic drug monitoring of amlodipine and the Z-FHL/HHL ratio: adherence tools in patients referred for apparent treatment-resistant hypertension

• Authors : Jones, E.S.W.; Lesosky, M.; Blockman, M.

• Source: SAMJ South African Medical Journal. October 2017, Vol. 107 Issue 10, p887, 5 p.

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Hypertension, end-stage renal disease and mesangiocapillary glomerulonephritis in methamphetamine users

• Authors : Jones, E.S.W.; Rayner, B.L.

• Source: SAMJ South African Medical Journal. March 1, 2015, p199, 3 p.

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Agricola

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Simultaneous Effect of Reaction Temperature and Concentration of Surfactant in Organo-Bentonite Synthesis

• Authors : Macuvele, Domingos Lusitâneo Pier; Nones, Janaína; Matsinhe, Jonas V.

• Source: Materials Science Forum; July 2017, Vol. 899 Issue: 1 p42-47, 6p

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A PROSPECTIVE STUDY COMPARING LAPAROSCOPIC ULTRASOUND AND TRANSABDOMINAL ULTRASOUND IN THE DETECTION OF COLORECTAL LIVER METASTASIS.

• Authors : CHAN, E.S.W.¹; CHUNG, C.C.¹; FUNG, W.T.²

Subjects: *ULTRASONIC imaging; *COLON cancer; *LIVER cancer

• Source: Annals of the College of Surgeons of Hong Kong. May2002, Vol. 6 Issue 2, pA1-A1. 3p.

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Investigating the impact of thermal mass on building performance using computational simulation.

• Authors : Wong, E.S.W.; Zaiyi Liao

• Source: IEEE International Conference on Advanced Management Science (ICAMS), 2010; 2010, p11-15, 5p

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Lead-free solder material characterization for thermo-mechanical modeling.

• Authors : Poh, E.S.W.; Zhu, W.H.; Zhang, X.R.

• Source: EuroSimE 2008 - International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Micro-Systems; 2008, p1-8, 8p

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A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board.

• Authors : Leung, E.S.W.; Yung, W.K.C.; Lee, W.B.

Subjects: ELECTROLESS plating; COPPER; PRINTED circuits

• Source: International Journal of Advanced Manufacturing Technology; Oct2004, Vol. 24 Issue 7/8, p474-484, 11p

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Quality and reliability of high aspect-ratio blind microvias formed by laser-assisted seeding mechanism in PCB.

• Authors : Leung, E.S.W.; Winco Kam-Chuen Yung

• Source: IEEE Transactions on Electronics Packaging Manufacturing; Apr2004, Vol. 27 Issue 2, p115-124, 10p

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Copper thickness and thermal reliability of microvias produced by laser-assisted seeding (LAS) process in printed circuit board (PCB) manufacture.

• Authors : Leung, E.S.W.; Yung, W.K.C.

• Source: Asian Journal on Quality; Jun2001, Vol. 2 Issue 2, p69-92, 24p

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