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Good Things Come in Micro Packages: Microelectronics are a booming business, but plastics producers must pack complex components into tiny spaces, leading to some challenges.

• Authors : Giordano, Geoff

• Source: Plastics Engineering. 2019, Vol. 75, Issue 3, pages. 5

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Designing experiments for the modern micro industries.

• Authors : Williams, Philip H.

• Source: Chemical Engineering Progress. 2006, Vol. 102, Issue 2, pages. 6

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Choosing the right "stacked" memory-packaging architecture for today's microelectronics applications: in each new memory-packaging architecture, system designers must weigh the attributes of stacked die versus stacked chip scale packages and other manufacturing issues.

• Authors : Steidl, Michael

• Source: EDN Asia. 2005, Vol. 14, Issue 11, pages. 5

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Microelectronics applications require the right stacked-memory-packaging architecture: it's sometimes difficult to achieve a distinction combination of memory chips to support high data performance, low power consumption, low cost, and high-volume production to meet consumer's needs.

• Authors : Sempek, David

• Source: EDN. 2005, Vol. 50, Issue 3, pages. 4

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DIAMONDS ARE A TINY MACHINE'S BEST FRIEND.

• Source: Business Week. 2000, Issue 3672, pages. 93

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Small displays loom large.

• Authors : Popovich, Milan

• Source: Photonics Spectra. 2000, Vol. 34, Issue 3, pages. 5

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Partnering for Success.

• Authors : Florence, Amy

• Source: EC&M Electrical Construction & Maintenance. 2008, Vol. 107, Issue 10.

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An e-fab way for making the micro world.

• Authors : Hill, Steve

• Source: Materials World. 1999, Vol. 7, Issue 9, pages. 3

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SiP System-in-Package Design and Simulation : Mentor EE Flow Advanced Design Guide

• Authors : Suny Li (Li Yang)

Subjects: Integrated circuits--Design and construction; Multichip modules (Microelectronics)--Design and constructionTECHNOLOGY & ENGINEERING / Electronics / Circuits / General

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Microscopic three-dimensional webs.

• Authors : Kraft, Arno

• Source: Chemistry and Industry. 2004, Issue 15, pages. 1

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